DESCRIPTION
The solder paste offers exceptional wetting characteristics, enabling uniform and thorough coverage on various substrates. Its low-voiding properties ensure consistent and reliable soldering results, reducing rework and improving production efficiency. With a carefully calibrated flux composition, the solder paste facilitates excellent solderability and flux activity, enhancing the soldering process and ensuring superior bond strength.
TECHNICAL DETAILS
- Alloy: Sn62.8Pb36.8Ag0.4
- Weight: 50g
- Mesh: 20-38um
- Melting Point: 183°C
SHIPPING LIST
- 1x Solder Paste
- 1x Plunger
- 1x Thin Needle
- 1x Thick Needle
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