Solder Paste

DESCRIPTION

The solder paste offers exceptional wetting characteristics, enabling uniform and thorough coverage on various substrates. Its low-voiding properties ensure consistent and reliable soldering results, reducing rework and improving production efficiency. With a carefully calibrated flux composition, the solder paste facilitates excellent solderability and flux activity, enhancing the soldering process and ensuring superior bond strength.

TECHNICAL DETAILS

• Alloy: Sn62.8Pb36.8Ag0.4
• Weight: 30g
• Mesh: 20-38um
• Melting Point: 183°C

SHIPPING LIST

• 1x Solder Paste
• 1x Plunger
• 1x Thin Needle
• 1x Thick Needle